Listen in While Experts Discuss Secure Heterogeneous Packaging via Technical Panel at IEEE PAINE 2021 on November 30

i3 Microsystems is honored to be invited as a panelist to join discussions on “Secure Heterogeneous Packaging” at the IEEE International PAINE 2021 conference. PAINE is mainly focused around physical device assurance and inspection of electronics for improving hardware security. The panel will be on November 30, 14:15-15:30 ET and in a fully online virtual format.…