Kulicke & Soffa Collaborates with i3 Microsystems to Develop Solutions for Next-Generation Advanced Microelectronics Packaging
Please see our press release for an announcement: https://i3electronics.com/micro_news_events/
Listen in While Experts Discuss Secure Heterogeneous Packaging via Technical Panel at IEEE PAINE 2021 on November 30
i3 Microsystems is honored to be invited as a panelist to join discussions on “Secure Heterogeneous Packaging” at the IEEE International PAINE 2021 conference. PAINE is mainly focused around physical device assurance and inspection of electronics for improving hardware security. The panel will be on November 30, 14:15-15:30 ET and in a fully online virtual format.…
Initial HSIP PDK Survey Responses from the Customer Community are now Available
Go to the user web forum to find the latest PDK survey results from the HSIP user community and learn what design tools are being used by early responders! Find the information here in the forum: https://hsip-pdk.info/community/pdk-survey-results/view-the-early-responder-results-from-the-hsip-pdk-survey-here/#post-1