If you are not quite ready to order your HSIP production components, perhaps inquire about an HSIP coffee cup instead in the meantime! Our coffee cup easily holds 16 ounces of hot coffee in a classic black encapsulant-style color, but when hot liquid hits the cup, our HSIP technology is slowly revealed, along with a…
Please see our press release for an announcement: https://i3electronics.com/micro_news_events/
i3 Microsystems is honored to be invited as a panelist to join discussions on “Secure Heterogeneous Packaging” at the IEEE International PAINE 2021 conference. PAINE is mainly focused around physical device assurance and inspection of electronics for improving hardware security. The panel will be on November 30, 14:15-15:30 ET and in a fully online virtual format.…
Go to the user web forum to find the latest PDK survey results from the HSIP user community and learn what design tools are being used by early responders! Find the information here in the forum: https://hsip-pdk.info/community/pdk-survey-results/view-the-early-responder-results-from-the-hsip-pdk-survey-here/#post-1