If you only have time to listen to one presentation from GOMACTech-2021 this is the one you don’t want to miss. Our team is here to help you will all of your simulation, design, and fabrication needs. http://hsip-pdk.info/wp-content/uploads/2021/07/GOMAC-2021-Heatons-3.mp4
Take a moment and watch our video, you will be walked through a guided tour of the topics covered in the website and how to navigate around. http://hsip-pdk.info/wp-content/uploads/2021/06/hsip-pdk-website-tour-video.mp4
Watch our recent presentation characterizing the stacking of two HSiP modules for reliability testing. You can design the same multi-slice HSiP devices with heterogeneous devices as easily as shown using our newly released Process Design Kit (PDK).
i3 Microsystems has set a date for the HSiP PDK alpha release to it’s customer base: June 25th 2021