i3 Microsystems has set a date for the HSiP PDK alpha release to it’s customer base: June 25th 2021
Watch our recent presentation characterizing the stacking of two HSiP modules for reliability testing. You can design the same multi-slice HSiP devices with heterogeneous devices as easily as shown using our newly released Process Design Kit (PDK).
If you only have time to listen to one presentation from GOMACTech-2021 this is the one you don’t want to miss. Our team is here to help you will all of your simulation, design, and fabrication needs. http://hsip-pdk.info/wp-content/uploads/2021/07/GOMAC-2021-Heatons-3.mp4Details
Go to the user web forum to find the latest PDK survey results from the HSIP user community and learn what design tools are being used by early responders! Find the information here in the forum: https://hsip-pdk.info/community/pdk-survey-results/view-the-early-responder-results-from-the-hsip-pdk-survey-here/#post-1Details
Listen in While Experts Discuss Secure Heterogeneous Packaging via Technical Panel at IEEE PAINE 2021 on November 30
i3 Microsystems is honored to be invited as a panelist to join discussions on “Secure Heterogeneous Packaging” at the IEEE International PAINE 2021 conference. PAINE is mainly focused around physical device assurance and inspection of electronics for improving hardware security. The panel will be on November 30, 14:15-15:30 ET and in a fully online virtual format.…Details
Kulicke & Soffa Collaborates with i3 Microsystems to Develop Solutions for Next-Generation Advanced Microelectronics Packaging
Please see our press release for an announcement: https://i3electronics.com/micro_news_events/Details