What primary services does i3M’s PDK offer?
Our HSIP PDK offers a design rule guide, design rule checking scripts in KLayout or Caliber, LSV scripts, and a network for subcontractors for schematic design, electrical and mechanical modeling to help you with your HSIP designs.
What HSIP form factors can I design into?
HSIP is a double-sided interposer technology with embedded active and passive IC’s in the interposer core. The core can be designed to a thickness range of 250 to 1200 microns, and the interconnect is capable of 7 layers per side and minimum feature sizes of 7/3 micron line/spaces.
What is the cost to me of using your PDK service?
How is my library data protected from competitors?
Critical project data is kept out of the Library contents. You may be asked for release permission regarding generic COTS components that your design utilizes, in certain scenarios.
What other subcontract services are available through the HSIP PDK web portal?
The PDK user environment offers a variety of HSIP-knowledgeable vendors who can be directly subcontracted by customers, or utilized through i3 Microsystems as task manager. The vendors include schematic design, device layout design, electrical modeling, and thermo-mechanical modeling vendors.
What are your PDK user terms and conditions?
Please inquire for more information.