It took some engineering work, but what you are seeing there is a 25 x 25 mm HSIP module with close to 80 embedded layer chips designed into it. This may not be for the faint of heart or for today’s high-volume production orders, but it is clearly feasible in HSIP technology and it was fully fabricated as a high yielding delivered customer product prototype with fourteen (14 !) interconnect layers in RDL, seven layers per side. Please your product inquiry today and see what HSIP can do for your heterogeneous system design. The die placement is shown with the die faces facedown onto the temporary carrier.